Film plating machine and electroplating production line

ABSTRACT

A film plating machine and electroplating production line are provided. The film plating machine has a plating solution tank, conductive substrate film conveying devices and a power supply. A plating solution and an anode member are provided in the plating solution tank. The conductive substrate film conveying devices are provided at both sides of the plating solution tank and configured to clamp two opposite side edges of a horizontally-placed conductive substrate film and drive the conductive substrate film to horizontally enter and exit the plating solution tank in a first direction. A positive electrode of the power supply is electrically connected with the anode member, and a negative electrode of the power supply is electrically connected with the conductive substrate film through the conductive substrate film conveying devices.

FIELD

The present application relates to the field of electroplatingtechnology, and in particular to a film plating machine andelectroplating production line.

BACKGROUND

As a green, environmentally friendly new energy source, lithium-ionbatteries have certain advantages such as a large capacity, a smallsize, and a light weight. Lithium-ion batteries have currently beenwidely applied in fields such as electrical vehicles, digital productsand household appliances.

A current collector is an important constituent part of a lithium-ionbattery, and mainly refers to a base metal such as copper foil andaluminum foil at a positive electrode or a negative electrode of thebattery for attaching active materials on the lithium-ion battery. Thefunction of the current collector is mainly to collect current generatedby the active material of the battery to form a larger current forexternal output. When the current collector is fabricated, a thick metalplating layer is usually formed on the conductive substrate film byelectroplating to ensure conductive performance of the currentcollector. Specifically, a film plating machine can be used toelectroplate the conductive substrate film.

In existing film plating machines, current of the negative electrode ofthe power supply is usually connected to the conductive substrate filmby using a conductive roller, so that the conductive substrate film iselectroplated in the plating solution. However, since the conductiveroller is usually provided outside the plating solution tank, theconductive substrate film is also outside the plating solution tank whenpassing through the conductive roller, where the electrical conductivityand the cooling effect of the conductive substrate film exposed to theair will decrease, and then the conductive substrate film would haveelectrical breakdown through-holes, which affects the product yield andwould reduce the electroplating efficiency.

SUMMARY

An embodiment of the present application discloses a film platingmachine and electroplating production line, capable of preventing theconductive substrate film from being electrically broken down, andcapable of improving the electroplating efficiency.

In order to achieve the above object, in a first aspect, an embodimentof the present application discloses a film plating machine, comprising:

-   -   a plating solution tank in which a plating solution and an anode        member are provided;    -   conductive substrate film conveying devices provided at both        sides of the plating solution tank and configured to clamp two        opposite side edges of a horizontally-placed conductive        substrate film and drive the conductive substrate film to        horizontally enter and exit the plating solution tank in a first        direction;    -   a power supply having a positive electrode electrically        connected with the anode member, and a negative electrode        electrically connected with the conductive substrate film        through the conductive substrate film conveying devices.

By the film plating machine provided by the embodiment of the presentapplication, in the process where the conductive substrate filmconveying device drives the conductive substrate film to convey, theconductive substrate film conveying device horizontally clamps andconveys the conductive substrate film, and electricity is conducted tothe conductive substrate film through the conductive substrate filmconveying device, and there is no need of using a conductive roller forconducting electricity. Therefore, the conductive substrate film can bealways located in the plating solution during the film plating process,thereby ensuring cooling effect of the conductive substrate film andpreventing the conductive substrate film from being electrically brokendown. Moreover, since the conductive substrate film in the platingsolution has a strong ability to withstand current, the power supplycurrent can be appropriately increased, so that the electroplatingefficiency is improved.

In a possible implementation in the first aspect, the conductivesubstrate film conveying device comprises:

-   -   a first conveying device comprising a first conveying belt, a        first driving assembly and a plurality of first conductive        clamps, the first conveying belt being extending along the first        direction; the plurality of first conductive clamps being        arranged on the first conveying belt along the first direction,        the plurality of first conductive clamps being electrically        communicated with a negative electrode of the power supply, and        the first driving assembly being configured to drive the first        conveying belt to convey the first conductive clamp along the        first direction;    -   a second conveying device comprising a second conveying belt, a        second driving assembly and a plurality of second conductive        clamps, the second conveying belt being extend along the first        direction; the plurality of second conductive clamps being        arranged on the second conveying belt along the first direction,        the plurality of second conductive clamps being electrically        communicated with a negative electrode of the power supply, and        the second driving assembly being configured to drive the second        conveying belt to convey the second conductive clamp along the        first direction;    -   wherein the first conveying belt and the second conveying belt        are symmetrically provided on both sides of the plating solution        tank, and the first conductive clamps and the second conductive        clamps are respectively configured to clamp the two opposite        side edges of the conductive substrate film.

Thus, the conductive substrate film can be horizontally clamped andconveyed, and the conductive substrate film can be electricallyconnected with the negative electrode of the power supply without usinga conductive roller.

In a possible implementation in the first aspect, each of the firstconductive clamp and the second conductive clamp comprises:

-   -   a first clamping portion comprising a first clamping face,        wherein the first clamping face is a conductive face and is        electrically communicated with the negative electrode of the        power supply;    -   a second clamping portion comprising a second clamping face,        wherein the second clamping face is a conductive face and is        electrically communicated with the negative electrode of the        power supply;    -   wherein the first clamping portion and the second clamping        portion can move relative to each other, so that the conductive        clamp is in a clamping state or an opening state, and the first        clamping face and the second clamping face both contact and are        electrically communicated with the conductive substrate film        when the conductive clamp clamps the conductive substrate film;        and    -   surfaces of the first conductive clamp and the second conductive        clamp are configured such that, except for the first clamping        face and the second clamping face, remaining surfaces that can        be immersed in the plating solution during film plating are        insulating surfaces.

Thus, when the first conductive clamp and the second conductive clampare immersed in the plating solution, their surfaces will not conductelectricity, so that current passing through the conductive substratefilm will not be reduced, and the electroplating efficiency is preventedfrom being reduced.

In a possible implementation in the first aspect, a first sealingportion is formed on the first clamping portion around the firstclamping face; a second sealing portion is formed on the second clampingportion around the second clamping face; and the first sealing portionand the second sealing portion cooperatively seal the first clampingface and the second clamping face when the conductive clamp clamps theconductive substrate film.

Thus, the plating solution is prevented from contacting the firstclamping face and the second clamping face, and thus the first clampingface and the second clamping face are prevented from being plated withcopper, ensuring successful opening and closing of the conductive clamp,and preventing the conductive substrate film from being punctured by theplating layer of the clamping face.

In a possible implementation in the first aspect, the first sealingportion is a first sealing ring provided around the first clamping face;the first sealing ring at least partially protrudes from the firstclamping face; the second sealing portion is a first annular sealingslot provided around the second clamping face; and a portion of thefirst sealing ring protruding from the first clamping face cooperativelyfits into the first annular sealing slot when the conductive clamp is inthe clamping state.

Thus, a structure where the sealing ring and the annular sealing slotcooperate is adopted, which may increase the sealing area and furtherimproves the sealing effect.

In a possible implementation in the first aspect, an opening and closingmechanism is further comprised; the opening and closing mechanismcomprises a first guide rail and a second guide rail symmetricallyprovided on both sides of the plating solution tank; the first guiderail and the second guide rail both extend along the first direction;the first guide rail is configured to cooperate with the firstconductive clamp to guide opening or closing of the first conductiveclamp; and the second guide rail is configured to cooperate with thesecond conductive clamp to guide opening or closing of the secondconductive clamp.

Thus, the normally open conductive clamp can be opened or closed at apreset position.

In a possible implementation in the first aspect, the first conductiveclamp is a normally open conductive clamp; the first guide railcorresponds to a position of the plating solution tank; the first guiderail comprises a closing guide section, a horizontal guide section andan opening guide section provided in sequence along the first direction;the first conductive clamp is gradually closed under a guiding action ofthe closing guide section when the first conductive clamp slides alongthe closing guide section; the first conductive clamp keeps moving inthe clamping state when the first conductive clamp slides along thehorizontal guide section; and the first conductive clamp is graduallyopened under a guiding action of the opening guide section when thefirst conductive clamp slides along the opening guide section.

Thus, the normally open conductive clamp can be opened or closed at apreset position.

In a possible implementation in the first aspect, the normally openconductive clamp comprises a bracket on which a guide column isprovided; the first clamping portion and the second clamping portion areboth slidably connected to the guide column; an elastic member isprovided between the first clamping portion and the second clampingportion; the elastic member is configured to keep the first clampingportion and the second clamping portion in the opening state; a movementtrajectory of the first conductive clamp is located between the upperguide rail and the lower guide rail; along a movement direction of thefirst conductive clamp, a gap between a lower surface of the upper guiderail and an upper surface of the lower guide rail first graduallynarrows, then remains unchanged, and finally increases gradually, and aportion of the first guide rail where the gap remains unchangedcorresponds to a position of the plating solution tank.

Thus, when the normally open conductive clamp moves to a portion where agap between the upper guide rail and the lower guide rail is graduallyreduced, the first clamping portion and the second clamping portion arerespectively squeezed by the upper guide rail and the lower guide railand gradually move closer to clamp the conductive substrate film; in thecourse where the normally open conductive clamp moves in the portionwith unchanged gap, the conductive substrate film is clamped andconveyed by the normally open conductive clamp in the plating solutiontank; when the normally open conductive clamp moves to the portion wherea gap between the upper guide rail and the lower guide rail is graduallyincreased, the first clamping portion and the second clamping portionare gradually separated from each other under an action of the elasticmember, so that the conductive substrate film may be released.

In a possible implementation in the first aspect, the conductive clampis a normally closed conductive clamp; the first guide rail comprises afirst guide section and a second guide section; the first guide sectioncorresponds to an entering side of the plating solution tank; the secondguide section corresponds to an exiting side of the plating solutiontank; the first guide section guides the first conductive clamp to openwhen the first conductive clamp slides along the first guide section;the first conductive clamp is in a normally closed state when the firstconductive clamp slides between the first guide section and the secondguide section; and the second guide section guides the first conductiveclamp to open again when the first conductive clamp slides along thesecond guide section.

Thus, the normally closed conductive clamp can be opened or closed at apreset position.

In a possible implementation in the first aspect, the first clampingportion is fixed relative to the first conveying belt; the secondclamping portion is movably connected with the first clamping portion;the second clamping portion can move up and down relative to the firstclamping portion and the second clamping face is located above the firstclamping face; the first guide section and the second guide sectioncomprise an ascending slope and a descending slope provided in sequencealong the first direction; the second clamping portion is graduallylifted when the second clamping portion cooperates with the ascendingslope, so that the first conductive clamp is opened; and the secondclamping portion is gradually lowered under an action of gravity whenthe second clamping portion cooperates with the descending slope, sothat the first conductive clamp is closed.

Thus, when the normally closed conductive clamp moves to the enteringside of the plating solution tank, the second clamping portioncooperates with the first guide section; the second clamping portion isfirst lifted by the ascending slope and then lowered along thedescending slope, so that the normally closed conductive clamp is openedand then closed, thereby clamping the conductive substrate film. Then,the normally closed conductive clamp, kept in the clamping state,conveys the conductive substrate film in the plating solution tank; whenthe normally closed conductive clamp moves to the exiting side of theplating solution tank, the second clamping portion cooperates with thesecond guide section and is lifted by the ascending slope of the secondguide section to open the normally closed conductive clamp to releasethe conductive substrate film.

In a possible implementation in the first aspect, the first conveyingbelt and the second conveying belt are both elliptical conveying belts.

Thus, the elliptical conveying belt may circularly convey the pluralityof first conductive clamps, so as to continuously convey the conductivesubstrate film.

In a possible implementation in the first aspect, the first conveyingbelt comprises a first horizontal section and a second horizontalsection; the first horizontal section and the second horizontal sectionare parallel to each other and extend along the first direction; one endof the first horizontal section is connected with one end of the secondhorizontal section by a first arc section, and the other end of thefirst horizontal section is connected with the other end of the secondhorizontal section by a second arc section; the first driving assemblycomprises a motor, a driving wheel and a driven wheel; a rotating shaftof the driving wheel and a rotating shaft of the driven wheel areparallel to each other; the motor is configured to drive the mater wheelto rotate, the first arc section is sleeved on the driving wheel, andthe second arc section is sleeved on the driven wheel.

Thus, by providing the driving wheel and the driven wheel to drive thefirst conveying belt to convey, the movement stability of the conveyingbelt can be improved.

In a possible implementation in the first aspect, the film platingmachine further comprises a first conductive clamp cleaning mechanismand a second conductive clamp cleaning mechanism symmetrically providedon both sides of the plating solution tank; the first conductive clampcleaning mechanism is configured to clean the first conductive clamp,and the second conductive clamp cleaning mechanism is configured toclean the second conductive clamp, the first conductive clamp cleaningmechanism comprising:

-   -   a first water washing device provided downstream from the        plating solution tank along the movement trajectory of the first        conductive clamp, and the first water washing device is        configured to wash the first conductive clamp with water to        remove plating solution on an exterior of the first conductive        clamp;    -   an acid pickling and electrolyzing device provided downstream        from the first water washing device along the movement        trajectory of the first conductive clamp, and the acid pickling        and electrolyzing device performs acid pickling and electrolysis        on the first conductive clamp with acid pickling solution to        remove a metal plating layer on an exterior of the first        conductive clamp; and    -   a second water washing device provided downstream from the acid        pickling and electrolyzing device along the movement trajectory        of the first conductive clamp, and the second water washing        device is configured to wash the first conductive clamp with        water to remove acid pickling solution on an exterior of the        first conductive clamp.

The above cleaning method may prevent the acid pickling solution frommixing with the plating solution, while ensuring a better cleaningeffect, thereby preventing the plating solution and the acid picklingsolution from being polluted.

In a possible implementation in the first aspect, a conductive mechanismis further comprised, the conductive mechanism comprising:

-   -   a first conductive assembly comprising a plurality of first        electric brushes arranged along the first direction, and a        plurality of first conductive blocks provided on the first        conveying belt, wherein the plurality of first electric brushes        are fixed relative to the plating solution tank and are        electrically connected to the negative electrode of the power        supply; the first conductive block can form a sliding electrical        connection with the first electric brush when the first        conveying belt drives the first conductive block to move to        positions of the first electric brushes; and    -   a second conductive assembly comprising a plurality of second        electric brushes arranged along the first direction, and a        plurality of second conductive blocks provided on the second        conveying belt, wherein the plurality of second electric brushes        are fixed relative to the plating solution tank and are        electrically connected to the negative electrode of the power        supply; the second conductive block can form a sliding        electrical connection with the second electric brushes when the        second conveying belt drives the second conductive block to move        to positions of the second electric brushes.

Thus, the conductive clamp is powered on only when the conductive clampclamps the conductive substrate film, thereby saving electric energy.

In a possible implementation in the first aspect, the plating solutiontank comprises:

-   -   a main tank in which the plating solution is provided;    -   an auxiliary tank in which the plating solution is provided, and        the plating solution in the main tank can overflow into the        auxiliary tank after reaching a preset solution level; and    -   a circulating pump configured to extract the plating solution in        the auxiliary tank and transport it into the main tank.

Thus, the plating solution can be circularly supplied, and thus theplating solution in the main tank is always in a flowing state, andmetal cations in the plating solution can be uniformly distributed inconcentration, so as to achieve a consistent thickness of the platinglayer on the surface of the conductive substrate film.

In a possible implementation in the first aspect, the anode member isformed by splicing a plurality of anode member splicing units; theplurality of anode member splicing units are arranged along a widthdirection of the plating solution tank, and two adjacent anode membersplicing units are separated by an insulating medium; and each anodemember splicing unit is connected with the positive electrode of thepower supply.

Thus, a parallel connection may be formed among the plurality of anodemember splicing units, and thus current of the power supply into eachanode member splicing unit is similar in magnitude, thereby ensuringconsistency of the plating layer on the surface of the conductivesubstrate film.

In a second aspect, an embodiment of the present application furtherdiscloses an electroplating production line comprising:

-   -   an unwinding mechanism configured to unwind a conductive        substrate film not plated with a film;    -   the film plating machine according to the first aspect; and    -   a winding mechanism configured to wind the conductive substrate        film plated with the film,        wherein the unwinding mechanism, the film plating machine and        the winding mechanism are sequentially provided along a        conveying direction of the conductive substrate film.

The electroplating production line provided by an embodiment of thepresent application adopts the film plating machine according to thefirst aspect. Therefore, the conductive substrate film can be kept inthe plating solution during the film plating process, and thus thecooling effect of the conductive substrate film can be ensured, and theconductive substrate film is prevented from being electrically brokendown. Moreover, since the conductive substrate film in the platingsolution has a strong ability to withstand current, the power supplycurrent can be appropriately increased, and the electroplatingefficiency is improved.

In a possible implementation in the second aspect, the following isfurther comprised:

-   -   a cleaning tank configured to clean the plating solution on a        surface of the conductive substrate film;    -   a passivation tank configured to form an anti-oxidation plating        layer on a surface of the conductive substrate film;    -   an oven configured to remove antioxidant solution remaining on a        surface of the conductive substrate film; and    -   a splitting device configured to cut off regions on both sides        of the conductive substrate film clamped by the conductive        substrate film conveying device,        wherein the cleaning tank, the passivation tank, the oven and        the splitting device are provided in sequence between the film        plating machine and the winding mechanism.

Thus, a current collector belt having a uniform plating layer and ananti-oxidation effect can be formed.

BRIEF DESCRIPTION OF DRAWINGS

Drawings required for use in the description of embodiments will beintroduced briefly below in order to explain the technical solutions ofthe embodiments of the present application more clearly, it will beapparent that the drawings described below are merely illustrative ofsome embodiments of the present application, and those skilled in theart can also obtain, from these drawings, other drawings withoutinventive efforts.

FIG. 1 is a structural schematic diagram of an existing electroplatingproduction line;

FIG. 2 is a three dimensionally structural schematic view of a filmplating machine provided by an embodiment of the present application;

FIG. 3 is a top view of FIG. 2 ;

FIG. 4 is a three dimensionally structural schematic view of a firstconveying device;

FIG. 5 is a three dimensionally structural schematic view of a normallyopen conductive clamp;

FIG. 6 is an exploding view of FIG. 5 ;

FIG. 7 is a structural schematic view of a normally open conductiveclamp entering and exiting an opening and closing mechanism;

FIG. 8 is a three dimensionally structural schematic view of a normallyclosed conductive clamp;

FIG. 9 is a structural schematic view of a normally closed conductiveclamp entering and exiting an opening and closing mechanism;

FIG. 10 is a structural schematic view of a normally closed conductiveclamp;

FIG. 11 is an enlarged view of a portion A in FIG. 10 ;

FIG. 12 is a cross-sectional view taken along A-A of FIG. 10 ;

FIG. 13 is a structural schematic view of a second clamping face of thenormally closed conductive clamp;

FIG. 14 is a three dimensionally structural schematic view of a filmplating machine provided with a conductive mechanism provided by anembodiment of the present application;

FIG. 15 is an enlarged view of a portion B in FIG. 14 ;

FIG. 16 is a top structural schematic view of a film plating machineprovided with a first conductive cleaning mechanism and a secondconductive cleaning mechanism provided by an embodiment of the presentapplication;

FIG. 17 is a sectional structural view of a plating solution tank;

FIG. 18 is a structural schematic view of an anode member;

FIG. 19 is a structural schematic view of an electroplating productionline provided by an embodiment of the present application.

Reference signs are described as follows:

-   -   01—unwinding reel, 02—electrolyte tank, 03—plating solution        bath, 04—water washing bath, 05—passivation bath, 06—drying box,        07—splitter, 08—anode plate, 09—conductive roller, 010—winding        reel, 100—plating solution tank, 101—main tank, 102—auxiliary        tank, 103—circulating pump, 104—liquid supply pipe, 105—spraying        device, 200—conductive substrate film conveying device,        201—first conveying belt, 2011—first horizontal section,        2012—second horizontal section, 2013—first arc section,        2014—second arc section, 202—second conveying belt, 203—first        conductive clamp, 2031—bracket, 2032—first clamping portion,        2033—second clamping portion, 2034—guide column, 2035—elastic        member, 2036—fixed clamping portion, 2037—movable clamping        portion, 20361—first clamping face, 20371—second clamping face,        2038—first sealing portion, 2039—second sealing portion,        204—second conductive clamp, 205—first driving assembly,        2051—driving wheel, 2052—driven wheel, 206—second driving        assembly, 300—anode member, 301—anode member splicing unit,        302—insulating medium, 400—opening and closing mechanism,        401—upper guide rail, 402—lower guide rail, 403—first guide        section, 404—second guide section, 4031—ascending slope,        4032—descending slope, 405—elliptical guide rail, 500—conductive        mechanism, 510—first conductive assembly, 511—first conductive        block, 512—first electric brush, 520—second conductive assembly,        521—second conductive block, 522—second electric brush,        600—first conductive clamp cleaning mechanism, 601—first water        washing device, 602—acid pickling and electrolyzing device,        603—second water washing device, 700—second conductive clamp        cleaning mechanism, 1—unwinding mechanism; 2—first flattening        roller, 3—film plating machine, 4—cleaning tank, 5—passivation        tank, 6—oven, 7—splitting device, 8—second flattening roller,        9—compression roller, 10—winding device, 800—conductive        substrate film.

DETAILED DESCRIPTION OF EMBODIMENTS

The technical solutions of the present application will be describedclearly and completely with reference to the drawings in embodiments ofthe present application. It is apparent that the embodiments describedare only some, but not all of the embodiments of the presentapplication. All the other embodiments, obtained by those skilled in theart in light of the embodiments of the present application withoutinventive efforts, will fall within the claimed scope of the presentapplication.

In the present application, orientation or positional relationshipindicated by terms “on”, “below”, “left”, “right”, “front”, “rear”,“top”, “bottom”, “inside”, “outside”, “center”, “vertical”,“horizontal”, “transversal”, “longitudinal”, etc. is based on theorientation or positional relationship shown in the drawings. Theseterms are primarily used to better describe the present application andits embodiments, and are not intended to define the indicated device,element or component must have a particular orientation, or must beconfigured and operated in a particular orientation.

Moreover, in addition to orientation or positional relationship, some ofthe above terms may be used to indicate other meanings, for example, theterm “on” may also be used to indicate a certain dependency orconnection relationship in some cases. For an ordinary skilled in theart, the specific meaning of the above terms in the present applicationmay be understood according to specific circumstances.

Furthermore, terms “install”, “provide”, “arrange”, “connect”, and“couple” should be interpreted broadly. For example, the connection maybe a fixed connection, a detachable connection, or a unitary structure;it may be a mechanical connection, or an electrical connection; it maybe a direct connection, or an indirectly connection made through anintermediate media, or it may be an inside communication between twodevices, elements, or components. For an ordinary skilled in the art,the specific meaning of the above terms in the present application maybe understood according to specific circumstances.

In addition, terms “first” and “second” etc. are mainly used todistinguish different devices, elements or components (the specifictypes and structures may be the same or different), and are not intendedto indicate or imply indicated relative importance and number of theindicated devices, elements or components. Unless stated otherwise,“plurality” means two or more than two.

Electroplating is a process in which a layer of other metals or alloysis plated on the surface of some plated members with the principle ofelectrolysis. For example, a plated metal or other insoluble material isused as the anode, the workpiece to be plated is used as the cathode,and the liquid containing ions of the plated metal is used as theplating solution. Before electroplating, the anode and the cathode arepowered on, and the current forms a loop among the anode, the platingsolution and the cathode. During the electroplating process, the cationsof the plated metal are reduced on the surface of the workpiece to beplated to form a plating layer.

In the process of fabricating a current collector of the lithium ionbattery, an electroplating process is usually used to form a thick metalplating layer on a conductive substrate film to fabricate the currentcollector. For example, the electroplating process can be completed byusing a film plating machine.

FIG. 1 shows a structural schematic diagram of an electroplatingproduction line, comprising the following provided in sequence: anunwinding reel 01, an electrolyte tank 02, a water washing bath 04, apassivation bath 05, a drying box 06, a splitter 07, and a winding reel010. The electrolyte tank 02 is provided therein with a plurality ofplating solution baths 03. Plating solution and an anode plate 08 areprovided in the plating solution bath 03. A conductive roller isprovided outside the plating solution bath 03. After being dischargedfrom the unwinding reel 01, the conductive substrate film then enterseach plating solution bath 03 in turn for electroplating. The anodeplate 08 in the plating solution bath 03 is electrically connected withthe anode of the power supply, the conductive roller 09 is electricallyconnected with the negative electrode of the power supply, and theconductive substrate film 800 passes through between the two conductiverollers 09 and contacts the conductive roller 09, such that theconductive substrate film 800 can be communicated with the negativeelectrode of the power supply, and that the conductive substrate film800 in the plating solution bath 03 is electroplated.

Since the conductive roller 09 is made of metal, in order to prevent thesurface of the conductive roller 09 from being electroplated, theconductive roller 09 can only be provided outside the plating solutionbath 03. Therefore, the conductive substrate film 800 is also outsidethe plating solution tank 03 when passing through the conductive roller09, where the cooling effect of the conductive substrate film 800exposed to the air will decrease, and then the conductive substrate film800 would have electrical breakdown through-holes, which affects theproduct yield. Moreover, since the ability of the conductive substratefilm 800 exposed to the air to withstand current will be weakened, alarger current cannot be applied, thereby affecting the efficiency ofconducting electricity.

In view of the above, an embodiment of the present application providesa film plating machine and electroplating production line, where theconductive film can be always in the plating solution during filmplating, such that the conductive substrate film may be prevented frombeing electrically broken down, and the electroplating efficiency may beimproved.

The film plating machine and electroplating production line will bedescribed in detail below through specific embodiments:

According to an exemplary embodiment of the present application, a filmplating machine is provided. As shown in FIGS. 2 and 3 , the filmplating machine comprises a plating solution tank 100, a conductivesubstrate film conveying device 200 and a power supply. Plating solutionand an anode member 300 are provided in the plating solution tank 100.The anode member 300 is immersed in the plating solution and iselectrically connected with the positive electrode of the power supply,acting as an electroplating anode.

The conductive substrate film conveying device 200 is configured toclamp the two opposite side edges of a horizontally-placed conductivesubstrate film 800 and drive the conductive substrate film 800 tohorizontally enter and exit the plating solution tank 100 in a firstdirection; and the conductive substrate film conveying device 200 iselectrically communicated with the negative electrode of the powersupply, so that the current can be conducted to the conductive substratefilm 800, and that the conductive substrate film 800 acts as theelectroplating cathode.

In the process in which the conductive substrate film conveying device200 drives the conductive substrate film 800 to convey, the conductivesubstrate film conveying device 200 horizontally clamps and conveys theconductive substrate film 800, and electricity is conducted to theconductive substrate film 800 through the conductive substrate filmconveying device 200, and there is no need of using a conductive rollerfor conducting electricity. Therefore, the conductive substrate film 800can be always located in the plating solution during the film platingprocess, thereby ensuring cooling effect of the conductive substratefilm 800 and preventing the conductive substrate film 800 from beingelectrically broken down. Moreover, since the conductive substrate film800 in the plating solution has a strong ability to withstand current,the power supply current can be appropriately increased, and theelectroplating efficiency is improved.

It should be noted that the above first direction is the direction inwhich the conductive substrate film 800 is conveyed, and it can also beunderstood as the lengthwise direction of the plating solution tank 100,that is, the direction X in FIGS. 2 and 3 .

In order to horizontally clamp and convey the conductive substrate film800, as shown in FIGS. 2 and 3 , the conductive substrate film conveyingdevice 200 may comprise a first conveying device and a second conveyingdevice, and the first conveying device comprises a first conveying belt201, a first driving assembly 205 and a first conductive clamp 203. Thesecond conveying device comprises a second conveying belt 202, a seconddriving assembly 206 and a second conductive clamp 204. The firstconveying belt 201 and the second conveying belt 202 are parallel toeach other and extend along the direction X. The first conveying belt201 and the second conveying belt 202 are respectively provided on bothsides of the plating solution tank 100. The first conveying belt 201 isprovided thereon with a plurality of first conductive clamps 203arranged in the direction X, and the second conveying belt 202 isprovided thereon with a plurality of second conductive clamps 204arranged in the direction X. The first driving assembly 205 isconfigured to drive the first conveying belt 201 to convey along thedirection X, thereby driving the first conductive clamp 203 to movealong the direction X, and the second driving assembly 206 is configuredto drive the second conveying belt 202 to move along the direction X,thereby driving the second conductive clamp 204 to move in the directionX.

The first conductive clamp 203 and the second conductive clamp 204 arerespectively configured to clamp the two opposite side edges of thehorizontally placed conductive substrate film 800, and the firstconductive clamp 203 and the second conductive clamp 204 can communicatewith the negative electrode of the power supply, when the firstconductive clamp 203 and the second conductive clamp 204 clamp theconductive substrate film 800. Thus, the conductive substrate film 800can be horizontally clamped and conveyed, and the conductive substratefilm 800 may be electrically connected with the negative electrode ofthe power supply without using a conductive roller.

In the following, the specific implementation for clamping and conveyingthe conductive substrate film 800 is illustrated by taking only thefirst conveying belt 201 and the first conductive clamp 203 as anexample, and a similar reference may be made with respect to theclamping and conveying mode for the second conveying belt 202 and thesecond conductive clamp 204.

As shown in FIG. 4 , the first conveying belt 201 is a closed ellipticalstructure, and is driven to rotate by the driving wheel 2051 and thedriven wheel 2052. For example, the elliptical conveying belt comprisesa first horizontal section 2011 and a second horizontal section 2012parallel to each other; the first horizontal section 2011 and the secondhorizontal section 2012 are parallel to each other and extend along thedirection X; one end of the first horizontal section 2011 is connectedwith one end of the second horizontal section 2012 by a first arcsection 2013, and the other end of the first horizontal section isconnected with the other end of the second horizontal section by asecond arc section 2014. The first arc section 2013 is sleeved on thedriving wheel 2051, and the second arc section 2014 is sleeved on thedriven wheel 2052. The rotating shaft of the driving wheel 2051 and therotating shaft of the driven wheel 2052 are provided vertically, and theconveying belt is provided upright, that is, the surface of theconveying belt is perpendicular to the horizontal plane. When thedriving wheel 2051 rotates, the elliptical conveying belt may be drivento move along an elliptical trajectory parallel to the horizontal plane.

The process where the first conveying belt 201 conveys the conductivesubstrate film 800 is approximately as follows: the plating solutiontank 100 is provided close to the first horizontal section 2011; thefirst conductive clamp 203 is provided around the circumference of theelliptical conveying belt; the first conductive clamp 203 clamps theconductive substrate film 800 when approaching the plating solution tank100, and drives the conductive substrate film 800 to enter the platingsolution tank 100, and also powers on the conductive substrate film 800through the clamping face. After leaving the plating solution tank 100,the first conductive clamp 203 releases the conductive substrate film800 and, driven by the elliptical conveying belt, turns to the side awayfrom the plating solution tank 100. A first conductive clamp cleaningmechanism may be provided on a side of the first conveying belt 201 awayfrom the plating solution tank 100 to clean the plating solution and theplating layer on the first conductive clamp 203, and the cleaned firstconductive clamp 203 is again conveyed by the elliptical conveying beltto a side close to the plating solution tank 100, to clamp and conveythe conductive substrate film 800 that enters subsequently. Theplurality of first conductive clamps 203 provided on the first conveyingbelt 201 perform the above operations cyclically, so as to continuouslyconvey the conductive substrate film 800.

In the above process, in order that the first conductive clamp 203 isopened or closed at the preset position, an opening and closingmechanism 400 for controlling the opening and closing of the firstconductive clamp 203 may be provided on the movement trajectory of thefirst conductive clamp 203. The opening and closing mechanism 400 isalso different with respect to the first conductive clamp 203 with adifferent structure, which will be described below by examples,respectively.

In a possible implementation, as shown in FIGS. 5 and 6 , the firstconductive clamp 203 is a normally open conductive clamp, comprising abracket 2031, a first clamping portion 2032 and a second clampingportion 2033; the bracket 2031 is provided thereon with a guide column2034, the first clamping portion 2032 and the second clamping portion2033 are both slidably connected with the guide column 2034, an elasticmember 2035 is provided between the first clamping portion 2032 and thesecond clamping portion 2033, and the elastic member 2035 is configuredto keep the first clamping portion 2032 and the second clamping portion2033 in the opening state.

In order that the normally open conductive clamp is opened or closed atthe preset position, the opening and closing mechanism 400 may beprovided as the following structure: as shown in FIG. 7 , the openingand closing mechanism 400 comprises an upper guide rail 401 and a lowerguide rail 402 oppositely provided, a movement trajectory of the firstconductive clamp 203 is located between the upper guide rail 401 and thelower guide rail 402; along a movement direction of the first conductiveclamp 203, a gap between a lower surface of the upper guide rail 401 andan upper surface of the lower guide rail 402 first gradually narrows,then remains unchanged, and finally increases gradually, and a portionof the first guide rail where the gap remains unchanged corresponds to aposition of the plating solution tank 100. Thus, when the normally openconductive clamp moves to a portion where a gap between the upper guiderail 401 and the lower guide rail 402 is gradually reduced, the firstclamping portion 2032 and the second clamping portion 2033 arerespectively squeezed by the upper guide rail 401 and the lower guiderail 402 and gradually move closer, and when the normally openconductive clamp enters the portion where a gap between the upper guiderail 401 and the lower guide rail 402 remains unchanged, the firstclamping portion 2032 and the second clamping portion 2033 fold to clampthe conductive substrate film 800; in the course where the normally openconductive clamp moves in the portion with unchanged gap, the conductivesubstrate film 800 is clamped and conveyed by the normally openconductive clamp in the plating solution tank 100; when the normallyopen conductive clamp moves to the portion where a gap between the upperguide rail 401 and the lower guide rail 402 is gradually increased, thefirst clamping portion 2032 and the second clamping portion 2033 aregradually separated from each other under an action of the elasticmember 2035, so that the conductive substrate film 800 may be released.Thus, the normally open conductive clamp can be opened or closed at apreset position.

In another possible implementation, as shown in FIG. 8 , the firstconductive clamp 203 is a normally closed conductive clip, comprising afixed clamping portion 2036 and a movable clamping portion 2037; thefixed clamping portion 2036 is fixed relative to the first conveyingbelt 201; the movable clamping portion 2037 is movably connected withthe fixed clamping portion 2036; the movable clamping portion 2037 canmove up and down relative to the fixed clamping portion 2036; and theclamping face of the movable clamping portion 2037 is located above theclamping face of the fixed clamping portion 2036.

In order that the normally closed conductive clamp is opened or closedat the preset position, the opening and closing mechanism 400 may beprovided as the following structure: as shown in FIG. 9 , the openingand closing mechanism 400 comprises a first guide section 403 and asecond guide section 404; the first guide section 403 corresponds to anentering side of the plating solution tank 100; the second guide section404 corresponds to an exiting side of the plating solution tank 100; thefirst guide section 403 and the second guide section 404 comprise anascending slope 4031 and a descending slope 4032 provided in sequencealong the first direction; the movable clamping portion 2037 isgradually lifted when the movable clamping portion 2037 cooperates withthe ascending slope 4031, so that the first conductive clamp 203 isopened, and the movable clamping portion 2037 is gradually lowered underan action of gravity when the movable clamping portion 2037 cooperateswith the descending slope 4032, so that the first conductive clamp 203is closed. Thus, when the normally closed conductive clamp moves to theentering side of the plating solution tank 100, the movable clampingportion 2037 cooperates with the first guide section 403, and themovable clamping portion 2037 is first lifted by the ascending slope4031 and then lowered along the descending slope 4032, so that thenormally closed conductive clamp is opened and then closed, therebyclamping the conductive substrate film 800. Then, the normally closedconductive clamp, kept in the clamping state, conveys the conductivesubstrate film 800 in the plating solution tank 100; when the normallyclosed conductive clamp moves to the exiting side of the platingsolution tank 100, the movable clamping portion 2037 cooperates with thesecond guide section 404 and is lifted by the ascending slope 4031 ofthe second guide section 404 to open the normally closed conductiveclamp to release the conductive substrate film 800. Thus, the normallyclosed conductive clamp can be opened or closed at a preset position.

In addition to the function of driving the conductive substrate film 800to move, the conductive clamp is also configured to electricallycommunicate the negative electrode of the power supply with theconductive substrate film 800. Therefore, the conductive clamp needs tobe able to conduct electricity. The normally closed conductive clamp istaken as an example, and as shown in FIGS. 10 and 11 , the fixedclamping portion 2036 of the conductive clamp comprises a first clampingface 20361 which is a conductive face and is electrically communicatedwith the negative electrode of the power supply; the movable clampingportion 2037 of the conductive clamp comprises a second clamping face20371 which is a conductive face and is electrically communicated withthe negative electrode of the power supply; when the conductive clampclamps the conductive substrate film 800, the first clamping face 20361and the second clamping face 20371 both contact and are electricallycommunicated with the conductive substrate film 800. Thus, theconductive substrate film 800 can be electrically communicated with thenegative electrode of the power supply.

Since the conductive clamp does not need to be connected to a powersupply when not clamping the conductive substrate film 800, in order tosave electric energy, the conductive clamp may be designed such that theconductive clamp is only powered on when clamping the conductivesubstrate film 800, and can be disconnected from the power supply whennot clamping the conductive substrate film 800. In order to perform theabove function, the following conductive mechanism 500 can be used.

As shown in FIGS. 14 and 15 , the conductive mechanism 500 comprises afirst conductive assembly 510 and a second conductive assembly 520; thefirst conductive assembly 510 comprises a plurality of first conductiveblocks 511 provided on an upper edge of the first conveying belt 201,and a plurality of first electric brushes 512 provided near an edge ofthe plating solution tank 100 and corresponding to position of the firsthorizontal section 2011 of the first conveying belt 201, and theplurality of first electric brushes 512 are electrically connected withthe negative electrode of the power supply. The plurality of firstelectric brushes 512 are all fixed structures and do not move with thefirst conveying belt 201, and they are arranged along the moving path ofthe first conductive blocks 511. When the first conveying belt 201drives the first conductive block 511 to move to the position of thefirst electric brush 512, a sliding electrical connection can be formedbetween the first conductive block 511 and the first electric brush 512,so that the corresponding first conductive clamp 203 below the firstconductive block 511 is electrically communicated with the negativeelectrode of the power supply. And the first conductive block 511 thatis not in contact with the first electric brush 512 is disconnected fromthe power supply, and the corresponding first conductive clamp 203 isalso not powered on. Thus, the first conductive clamp 203 is powered ononly when the conductive substrate film 800 is clamped, thereby savingelectric energy.

Correspondingly the second conductive assembly 520 comprises a pluralityof second conductive blocks 521 provided on an upper edge of the secondconveying belt 202, and a plurality of second electric brushes 522provided near an edge of the plating solution tank 100 and correspondingto the side of the second conveying belt 202 close to the platingsolution tank, and the plurality of second electric brushes 522 areelectrically connected with the negative electrode of the power supply.The plurality of second electric brushes 522 are all fixed structuresand do not move with the second conveying belt 202, and they arearranged along the moving path of the second conductive blocks 521. Thesecond conductive assembly 520 and the first conductive assembly 510have similar operating principles, and details are not described here.

Further, the length that the plurality of first electric brushes 512 andthe plurality of second electric brushes 522 are arranged along thefirst direction can be adaptive to the length of the plating solutiontank 100, so that the first conductive clamp 203 and the secondconductive clamp 204 can always be electrically communicated with thenegative electrode of the power supply while moving in the platingsolution tank 100, and the first conductive clamp 203 and the secondconductive clamp 204 are disconnected from the power supply when leavingthe plating solution tank.

In the process of electroplating, the conductive clamp needs to enterand exit the plating solution frequently. Moreover, because theconductive clamp is made of conductive material, a plating layer isoften formed on the surface of the conductive clamp, which affects theuse of the conductive clamp. Moreover, generally the electricalconductivity of the conductive clamp will be stronger than that of theplating layer, so directly contacting the conductive clamp with theplating solution will reduce the current flowing through the platingmember, thereby reducing the electroplating efficiency.

Therefore, in order to prevent the above problem, all portions of theconductive clamp except the clamping face can be designed as insulatingsurfaces. For example, the entire conductive clamp can be made ofinsulating materials, with a conductive sheet provided only on the firstclamping face 20361 and the second clamping face 20371, where theconductive sheet is then connected to the negative electrode of thepower supply through a wire.

In addition, as shown in FIG. 10 , the entire conductive clamp can alsobe made of conductive metal material, and then a layer of insulatingsleeve is encapsulated on the surface of the conductive clamp, and theinsulating sleeve is provided avoiding from the first clamping face20361 and the second clamping face 20371. By such a provision, theentire interior of the conductive clamp may be a conductive body, sothat electrically can be conducted from the interior of the conductiveclamp, powering on the first clamping face 20361 and the second clampingface 20371. For example, the top of the conductive clamp may have aportion of conductive surface exposed and not encapsulated with aninsulating layer, or may have a conductive hole opened at the top toconnect with the negative electrode of the power supply, such that theprovision of wires may be avoided, and the structure of the conductiveclamp is simplified.

In order to further prevent the clamping face of the conductive clampfrom being plated with copper, as shown in FIG. 11 , a first sealingportion 2038 may be provided around the first clamping face 20361, and asecond sealing portion 2039 may be provided around the second clampingface 20371. Thus, when the conductive clamp is in the clamping state,the first sealing portion 2038 can cooperate with the second sealingportion 2039 to seal the first clamping face 20361 and the secondclamping face 20371. When the conductive clamp in the clamping stateneeds to enter the plating solution, the portion of the conductive clampentering the plating solution will be completely protected by theinsulating layer, so that the current flowing through the plating memberwill be increased and the plating efficiency will be improved. Moreover,the region where the first clamping face 20361 and the second clampingface 20371 of the conductive clamp are located will be sealed by thefirst sealing portion 2038 and the second sealing portion 2039 aftercooperating, and thus the plating solution is prevented from contactingthe first clamping face 20361 and the second clamping face 20371, andthus the first clamping face 20361 and the second clamping face 20371are prevented from being plated with copper, so that successful openingand closing of the conductive clamp are ensured, and the conductivesubstrate film 800 is prevented from being punctured by plating layer onthe clamping face.

For example, the first sealing portion 2038 and the second sealingportion 2039 may be implemented in various manners. As shown in FIGS. 12and 13 , the first sealing portion 2038 may be designed as a firstsealing ring provided around the first clamping face 20361, and thesecond sealing portion 2039 may be designed as a first annular sealingslot provided around the second clamping face 20371; when the conductiveclamp is in the clamping state, the portion of the first sealing ringprotruding from the first clamping face 20361 cooperatively fits intothe first annular sealing slot, and the conductive substrate film 800 incontact with the end of the first sealing ring is also squeezed into thefirst annular sealing slot along with the first sealing ring, therebysealing the first clamping face 20361 and the second clamping face 20371to prevent the plating solution from contacting the clamping face. Withthe structure being a structure where the sealing ring and the annularsealing slot cooperate, the sealing area may be increased, and thesealing effect may be further improved.

Of course, although the above protection measures are taken, theconductive clamp may still be plated with copper under some specialcircumstances, and the conductive clamp will also appear to have aplating solution after being removed from the plating solution tank 100.Therefore, the conductive clamp removed from the plating solution tank100 can be cleaned, so as to improve the operating reliability of theconductive clamp. For example, a conductive clamp cleaning mechanism maybe provided on the movement trajectory after the conductive clamp isremoved out of the plating solution tank 100. As shown in FIG. 16 , theconductive clamp cleaning mechanism comprises a first conductive clampcleaning mechanism 600 and a second conductive clamp cleaning mechanism700 symmetrically provided on both sides of the plating solution tank100; the first conductive clamp cleaning mechanism 600 is configured toclean the first conductive clamp 203, and the second conductive clampcleaning mechanism 700 is configured to clean the second conductiveclamp 204. The first conductive clamp cleaning mechanism 600 is taken asan example below for illustration, and a similar reference may be madewith respect to the second conductive clamp cleaning mechanism 700.

As shown in FIG. 16 , the first conductive clamp cleaning mechanism 600comprises a first water washing device 601, an acid pickling andelectrolyzing device 602 and a second water washing device 603 providedin sequence along the movement trajectory of the first conductive clamp203, wherein the first water washing device 601 is provided downstreamfrom the plating solution tank 100, and the first water washing device601 is configured to wash the first conductive clamp 203 with water toremove the plating solution on the exterior of the first conductiveclamp 203. The acid pickling and electrolyzing device 602 performs acidpickling and electrolysis on the first conductive clamp 203 with acidpickling solution to remove a metal plating layer on the exterior of thefirst conductive clamp 203. The second water washing device 603 isconfigured to wash the first conductive clamp 203 with water to removethe acid pickling solution on the exterior of the first conductive clamp203. The above cleaning method may prevent the acid pickling solutionfrom mixing with the plating solution while ensuring a better cleaningeffect, thereby preventing the plating solution and the acid picklingsolution from being polluted.

For example, when an elliptical conveying belt is used, the first waterwashing device 601, the acid pickling and electrolyzing device 602 andthe second water washing device 603 are sequentially provided along theconveying direction of the second horizontal section 2012. After leavingthe plating solution tank 100, the first conductive clamp 203, driven bythe elliptical conveying belt, turns to a side of the first conveyingbelt 201 away from the plating solution tank 100, passing through thefirst water washing device 601, the acid pickling and electrolyzingdevice 602 and the second water washing device 603 in sequence, wherethe cleaned first conductive clamp 203 is again conveyed by theelliptical conveying belt into the plating solution tank 100, to clampand convey the conductive substrate film 800.

In the above embodiment, in order to keep the first conductive clamp 203in the opening state when passing through the first water washing device601, the acid pickling and electrolyzing device 602 and the second waterwashing device 603, as shown in FIG. 16 , the opening and closingmechanism 400 may be provided as an elliptical guide rail 405 with afracture; the elliptical guide rail 405 is provided around theelliptical conveying belt, and the fracture of the elliptical guide rail405 corresponds to the position of the plating solution tank 100. Bysuch a provision, the first conductive clamp 203 and the ellipticalguide rail 405 are in the opening state at positions where theycooperate, and are only closed at the fracture. Thus, the firstconductive clamp 203 is kept in the opening state when passing throughthe first water washing device 601, the acid pickling and electrolyzingdevice 602 and the second water washing device 603, and thus thecleaning device is facilitated to clean the clamping face of theconductive clamp, and the cleaning effect is improved.

The plating solution tank 100 is provided therein with a platingsolution, and the plating solution contains metal cations for formingthe electroplating layer. In order to homogenize the concentration ofmetal cations in the plating solution, the plating solution can be keptin a flowing state. In order to achieve the above purpose, as shown inFIG. 17 , the plating solution tank 100 comprises a main tank 101 and anauxiliary tank 102. The main tank 101 and the auxiliary tank 102 areboth provided with plating solution, and the plating solution in themain tank 101 can overflow into the auxiliary tank 102 after reachingthe preset liquid level. A circulating pump 103 is also connectedbetween the main tank 101 and the auxiliary tank 102, and thecirculating pump 103 can extract the plating solution in the auxiliarytank 102 and transport it into the main tank 101.

Thus, the plating solution in the main tank 101 can overflow into theauxiliary tank 102 after reaching the preset liquid level, and theplating solution in the auxiliary tank 102 can be replenished into themain tank 101 under the action of the circulating pump 103 and thespraying device 105. Thus, the plating solution can be circularlysupplied, and thus the plating solution in the main tank 101 is alwaysin a flowing state, and metal cations in the plating solution can beuniformly distributed in concentration, so as to achieve a consistentthickness of the plating layer on the surface of the conductivesubstrate film 800.

For example, a liquid supply pipe 104 may be provided in the main tank101 or a spraying device 105 may be provided above the main tank 101,and the circulating pump 103 is connected with the liquid supply pipe104 or the spraying device 105 to replenish the plating solution to themain tank 101.

The anode member 300 is another factor affecting the consistency of thesurface thickness of the conductive substrate film 800. Since the anodemember 300 is usually an integral structure, the length of the anodemember 300 is adaptive to the width specification of the film platingmachine. When the width specification of the film plating machine issmall, the length of the anode member 300 is small, and the currentflowing in each portion of the anode member is similar, and theconsistency of the plating layer on the surface of the conductivesubstrate film 800 can be ensured; when the width specification of thefilm plating machine is large, the length of the anode member 300 willbe longer, and since the current is usually connected from both ends ofthe anode member 300, the current at both ends of the anode member 300will be large, and the current in the middle portion of the anode member300 will be too small. However, the magnitude of the current willdirectly affect the thickness of the plating layer on the conductivesubstrate film 800, that is, the region with a larger current on theanode member 300 will render a thicker plating layer in thecorresponding region on the conductive substrate film 800, and theregion with a small current on the anode member 300 will render athinner plating layer in the corresponding region on the conductivesubstrate film 800.

Therefore, in order to improve the consistency of the plating layer onthe surface of the conductive substrate film 800, as shown in FIG. 18 ,the anode member 300 may be formed by splicing a plurality of anodemember splicing units 301, where the plurality of anode member splicingunits 301 are arranged along a widthwise direction of the platingsolution tank 100, and two adjacent anode member splicing units 301 areseparated by an insulating medium 302, and each anode member splicingunit 301 is connected to the positive electrode of the power supply.

Thus, a parallel connection may be formed among a plurality of anodemember splicing units 301, and thus current of the power supply intoeach anode member splicing unit 301 is similar in magnitude, therebyensuring consistency of the plating layer on the surface of theconductive substrate film 800.

It should be noted that the above anode member splicing unit 301 may bea soluble anode member, such as titanium blue and phosphor bronze ballsprovided in the titanium blue, or may be an insoluble anode member, suchas an insoluble anode plate. Limitation is not made here.

According to another exemplary embodiment of the present application, anelectroplating production line is provided. As shown in FIG. 19 , theelectroplating production line an unwinding mechanism 1, a firstflattening roller 2, a film plating machine, a cleaning tank 4, apassivation tank 5, an oven 6, a splitting device 7, a second flatteningroller 8, a compression roller 9, and a winding device 10 provided insequence along the conveying direction of the conductive substrate film800.

The specific operation process of the above electroplating productionline is as follows: before film plating, a traction film is provided onthe unwinding mechanism 1, and then the mechanical transmission portionof the electroplating production line is started, and driven by themechanical transmission portion, the traction film passes through theentire production line and reaches the winding mechanism; afterconnecting the traction film with the winding mechanism, a conductivesubstrate film 800 to be plated is provided at the unwinding mechanism1, and the conductive substrate film 800 to be plated is bonded to thetraction film, so that the traction film tracts the conductive substratefilm 800 to pass through the first flattening roller 2, the platingsolution tank 100 of the film plating machine, the cleaning tank 4, thepassivation tank 5, the oven 6, the splitting device 7, the secondflattening roller 8, and the compression roller 9, in sequence, andfinally reaches the winding device 10 to be winded. Finally, the currentcollector product plated with the film can be obtained.

It should be noted that the mechanical transmission portion of the abovestarting equipment mainly refers to starting the unwinding mechanism 1,the winding mechanism, the conductive substrate film conveying device200 of the film plating machine, and one or more driving rollersdistributed on the entire production line (not shown in the figures).The function of the above portion is to provide transmission power tothe conductive substrate film, and the rotation speed is the same, sothat the function of conveying the conductive substrate film at aconstant speed is performed, and the conductive substrate film isprevented from wrinkling or being pulled too tightly during theconveying process.

The unwinding mechanism 1 is configured to unwind the conductivesubstrate film 800 not film plated, and the sent out conductivesubstrate film 800 is flattened by the first flattening roller 2 to betransported forward in the horizontal direction, and then the conductivesubstrate film conveying device 200 of the film plating machine clampstwo opposite side edges of the conductive substrate film 800, andconveys the conductive substrate film 800 into the plating solution tank100 for electroplating, and the electroplated conductive substrate film800 enters the cleaning tank 4 for cleaning to remove the remainingplating solution on the surface of the conductive substrate film 800,where the cleaned conductive substrate film 800 enters the passivationtank 5 that is configured to form an anti-oxidation plating layer on thesurface of the conductive substrate film 800 to prevent the platinglayer from being oxidized and discolored in the air. The conductivesubstrate film 800 formed with the anti-oxidation plating layer is thensent into the oven 6 to remove the anti-oxidation solution remaining onthe surface of the conductive substrate film 800. The dried conductivesubstrate film 800 is split by the splitting device 7 to remove theregion on both sides of the conductive substrate film 800 clamped by theconductive substrate film conveying device 200 or to remove the regionin which the plating layer is thicker on both sides of the conductivesubstrate film 800 due to the edge effect of the current. The conductivesubstrate film 800 kept after the splitting is winded by the windingdevice 10, and the compression roller 9 provided on the winding device10 can compress tightly the conductive substrate film 800 to ensure thehardness and flatness of the winding.

Finally, it should be noted that the above embodiments are only used toillustrate the technical solutions of the present utility model, ratherthan limiting the same; although the present application has beendescribed in detail with reference to the foregoing embodiments, thoseof ordinary skill in the art should understand that: It is stillpossible to modify the technical solutions described in the foregoingembodiments or equivalently replace some or all of the technicalfeatures; and these modifications or replacements do not deviate theessence of the corresponding technical solutions from the technicalsolutions of the embodiments of the present utility model.

1. A film plating machine comprising: a plating solution tank foraccommodating a plating solution and an anode member; conductivesubstrate film conveying devices provided at both sides of the platingsolution tank respectively, wherein the conductive substrate filmconveying devices are configured to clamp two opposite side edges of ahorizontally-placed conductive substrate film and drive the conductivesubstrate film to horizontally enter and exit the plating solution tankin a first direction; and a power supply having a positive electrodeelectrically connected with the anode member, and a negative electrodeelectrically connected with the conductive substrate film through theconductive substrate film conveying devices.
 2. The film plating machineaccording to claim 1, wherein the conductive substrate film conveyingdevices comprise: a first conveying device comprising a first conveyingbelt, a first driving assembly and a plurality of first conductiveclamps; the first conveying belt extending along the first direction;the plurality of first conductive clamps being arranged on the firstconveying belt along the first direction; the plurality of firstconductive clamps being electrically communicated with the negativeelectrode of the power supply, and the first driving assembly beingconfigured to drive the first conveying belt to convey the firstconductive clamps along the first direction; and a second conveyingdevice comprising a second conveying belt, a second driving assembly anda plurality of second conductive clamps; the second conveying beltextending along the first direction; the plurality of second conductiveclamps being arranged on the second conveying belt along the firstdirection; the plurality of second conductive clamps being electricallycommunicated with a negative electrode of the power supply, and thesecond driving assembly being configured to drive the second conveyingbelt to convey the second conductive clamps along the first direction;wherein the first conveying belt and the second conveying belt aresymmetrically provided on both sides of the plating solution tank, andthe first conductive clamps and the second conductive clamps arerespectively configured to clamp the two opposite side edges of theconductive substrate film.
 3. The film plating machine according toclaim 2, wherein each of the first conductive clamp and the secondconductive clamp comprises: a first clamping portion comprising a firstclamping face, wherein the first clamping face is a conductive face andis electrically communicated with the negative electrode of the powersupply; and a second clamping portion comprising a second clamping face,wherein the second clamping face is a conductive face and iselectrically communicated with the negative electrode of the powersupply; wherein the first clamping portion and the second clampingportion can move relative to each other, so that the conductive clampsare in a clamping state or an opening state, and the first clamping faceand the second clamping face both contact and are electricallycommunicated with the conductive substrate film when the conductiveclamp clamps the conductive substrate film; and wherein surfaces of thefirst conductive clamp and the second conductive clamp are configuredsuch that, except for the first clamping face and the second clampingface, remaining surfaces that can be immersed in the plating solutionduring film plating are insulating surfaces.
 4. The film plating machineaccording to claim 3, wherein a first sealing portion is formed on thefirst clamping portion around the first clamping face; a second sealingportion is formed on the second clamping portion around the secondclamping face; and the first sealing portion and the second sealingportion cooperatively seal the first clamping face and the secondclamping face when the conductive clamp clamps the conductive substratefilm.
 5. The film plating machine according to claim 4, wherein thefirst sealing portion is a first sealing ring provided around the firstclamping face; the first sealing ring at least partially protrudes fromthe first clamping face; and the second sealing portion is a firstannular sealing slot provided around the second clamping face, and aportion of the first sealing ring protruding from the first clampingface cooperatively fits into the first annular sealing slot when theconductive clamp is in the clamping state.
 6. The film plating machineaccording to claim 3, further comprising an opening and closingmechanism; wherein the opening and closing mechanism comprises a firstguide rail and a second guide rail symmetrically provided on both sidesof the plating solution tank; the first guide rail and the second guiderail both extend along the first direction; and the first guide rail isconfigured to cooperate with the first conductive clamp to guide openingor closing of the first conductive clamp, and the second guide rail isconfigured to cooperate with the second conductive clamp to guideopening or closing of the second conductive clamp.
 7. The film platingmachine according to claim 6, wherein the first conductive clamp is anormally open conductive clamp; the first guide rail corresponds to aposition of the plating solution tank; the first guide rail comprises aclosing guide section, a horizontal guide section and an opening guidesection provided in sequence along the first direction; the firstconductive clamp is gradually closed under a guiding action of theclosing guide section when the first conductive clamp slides along theclosing guide section; the first conductive clamp keeps moving in theclamping state when the first conductive clamp slides along thehorizontal guide section; and the first conductive clamp is graduallyopened under a guiding action of the opening guide section when thefirst conductive clamp slides along the opening guide section.
 8. Thefilm plating machine according to claim 7, wherein the normally openconductive clamp comprises a bracket on which a guide column isprovided; the first clamping portion and the second clamping portion areboth slidably connected to the guide column; and an elastic member isprovided between the first clamping portion and the second clampingportion, and the elastic member is configured to keep the first clampingportion and the second clamping portion in the opening state; andwherein the first guide rail comprises an upper guide rail and a lowerguide rail oppositely provided; a movement trajectory of the firstconductive clamp is located between the upper guide rail and the lowerguide rail; along a movement direction of the first conductive clamp, agap between a lower surface of the upper guide rail and an upper surfaceof the lower guide rail first gradually narrows, subsequently remainsunchanged, and finally increases gradually, and a portion of the firstguide rail where the gap remains unchanged corresponds to a position ofthe plating solution tank.
 9. The film plating machine according toclaim 6, wherein the conductive clamp is a normally closed conductiveclamp; the first guide rail comprises a first guide section and a secondguide section; the first guide section corresponds to an entering sideof the plating solution tank; the second guide section corresponds to anexiting side of the plating solution tank; the first guide sectionguides the first conductive clamp to open when the first conductiveclamp slides along the first guide section; the first conductive clampis in a normally closed state when the first conductive clamp slidesbetween the first guide section and the second guide section; and thesecond guide section guides the first conductive clamp to open againwhen the first conductive clamp slides along the second guide section.10. The film plating machine according to claim 9, wherein the firstclamping portion is fixed relative to the first conveying belt; thesecond clamping portion is movably connected with the first clampingportion; the second clamping portion can move up and down relative tothe first clamping portion and the second clamping face is located abovethe first clamping face, and wherein the first guide section and thesecond guide section comprise an ascending slope and a descending slopeprovided in sequence along the first direction; the second clampingportion is gradually lifted when the second clamping portion cooperateswith the ascending slope, so that the first conductive clamp is opened,and the second clamping portion is gradually lowered under an action ofgravity when the second clamping portion cooperates with the descendingslope, so that the first conductive clamp is closed.
 11. The filmplating machine according to claim 2, wherein the first conveying beltand the second conveying belt are each an elliptical conveying belt. 12.The film plating machine according to claim 11, wherein the firstconveying belt comprises a first horizontal section and a secondhorizontal section; the first horizontal section and the secondhorizontal section are parallel to each other and extend along the firstdirection; one end of the first horizontal section is connected with oneend of the second horizontal section by a first arc section, and theother end of the first horizontal section is connected with the otherend of the second horizontal section by a second arc section; andwherein the first driving assembly comprises a motor, a driving wheeland a driven wheel; a rotating shaft of the driving wheel and a rotatingshaft of the driven wheel are parallel to each other; the motor isconfigured to drive the mater wheel to rotate, the first arc section issleeved on the driving wheel, and the second arc section is sleeved onthe driven wheel.
 13. The film plating machine according to claim 2,wherein the film plating machine further comprises a first conductiveclamp cleaning mechanism and a second conductive clamp cleaningmechanism symmetrically provided on both sides of the plating solutiontank; the first conductive clamp cleaning mechanism is configured toclean the first conductive clamp, and the second conductive clampcleaning mechanism is configured to clean the second conductive clamp,the first conductive clamp cleaning mechanism comprising: a first waterwashing device provided downstream from the plating solution tank alongthe movement trajectory of the first conductive clamp, the first waterwashing device being configured to wash the first conductive clamp withwater to remove plating solution on an exterior of the first conductiveclamp; an acid pickling and electrolyzing device provided downstreamfrom the first water washing device along the movement trajectory of thefirst conductive clamp, the acid pickling and electrolyzing deviceperforming acid pickling and electrolysis on the first conductive clampwith acid pickling solution to remove a metal plating layer on anexterior of the first conductive clamp; and a second water washingdevice provided downstream from the acid pickling and electrolyzingdevice along the movement trajectory of the first conductive clamp, thesecond water washing device being configured to wash the firstconductive clamp with water to remove acid pickling solution on anexterior of the first conductive clamp.
 14. The film plating machineaccording to claim 2, wherein a conducting mechanism is furthercomprised, the conducting mechanism comprising: a first conductiveassembly comprising a plurality of first electric brushes arranged alongthe first direction, and a plurality of first conductive blocks providedon the first conveying belt, wherein the plurality of first electricbrushes are fixed relative to the plating solution tank and areelectrically connected to the negative electrode of the power supply;the first conductive blocks can form a sliding electrical connectionwith the first electric brushes when the first conveying belt drives thefirst conductive blocks to move to positions of the first electricbrushes; and a second conductive assembly comprising a plurality ofsecond electric brushes arranged along the first direction, and aplurality of second conductive blocks provided on the second conveyingbelt, wherein the plurality of second electric brushes are fixedrelative to the plating solution tank and are electrically connected tothe negative electrode of the power supply; the second conductive blockcan form a sliding electrical connection with the second electricbrushes when the second conveying belt drives the second conductiveblock to move to positions of the second electric brushes.
 15. The filmplating machine according to claim 1, wherein the plating solution tankcomprises: a main tank in which the plating solution is provided; anauxiliary tank in which the plating solution is provided, and theplating solution in the main tank can overflow into the auxiliary tankafter reaching a preset solution level; and a circulating pumpconfigured to extract the plating solution in the auxiliary tank andtransport it into the main tank.
 16. The film plating machine accordingto claim 1, wherein the anode member is formed by splicing a pluralityof anode member splicing units; the plurality of anode member splicingunits are arranged along a width direction of the plating solution tank,and two adjacent anode member splicing units are separated by aninsulating medium; and each anode member splicing unit is connected withthe positive electrode of the power supply.
 17. An electroplatingproduction line comprising: an unwinding mechanism configured to unwinda conductive substrate film not plated with a film; the film platingmachine according to claim 1; and a winding mechanism configured to windthe conductive substrate film plated with the film, wherein theunwinding mechanism, the film plating machine and the winding mechanismare sequentially provided along a conveying direction of the conductivesubstrate film.
 18. The electroplating production line according toclaim 17, further comprising: a cleaning tank configured to clean theplating solution on a surface of the conductive substrate film; apassivation tank configured to form an anti-oxidation plating layer onthe surface of the conductive substrate film; an oven configured toremove antioxidant solution remaining on a surface of the conductivesubstrate film; and a splitting device configured to cut off regions onboth sides of the conductive substrate film clamped by the conductivesubstrate film conveying device, wherein the cleaning tank, thepassivation tank, the oven and the splitting device are provided insequence between the film plating machine and the winding mechanism.